Boris Spokoinyi

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Our Services

We have extensive expertise in designing complex RF systems and components from low frequencies up to and including mm-wave bands for Bluetooth, Wi-Fi, ZigBee, DVB-T/H, GSM, GPS, and custom proprietary standards.

 

 RF/Microwave Design

  • Passive Components: Antennas, Filters, Matching Networks, Splitters/Combiners
  • Active Components: PAs, LNAs, Mixers
  • RF systems: Frequency Synthesizers, Up/Down converters
 

 Digital Design

  • Digital Signal Processing (DSP)
  • Processor interfaces and high speed buses: DDR, 10G Ethernet, JESD204B
  • Experience in Xilinx, Altera, Lattice Semi FPGAs/CPLDs
 

 Layout Services

  • High frequency (up to 60GHz)
  • High density layout (BGA breakout, up to 32 layers)
  • EMC compliance (2D/3D EM simulation)
 

 Modeling & Simulation

  • 2D/3D Electromagnetic simulation (PCB elements, antennas, waveguides).
  • Circuit simulation (RF, analog, digital).
  • System simulation (comunication systems, control, hardware, firmware, DSP).
  • Thermal and Mechanical simulation.
 

 Embedded Software

  • C/C++ coding for Microcontrollers and CPUs.
  • Firmware/Hardware co-development.
  • Digital Signal Processing (DSP) and Control Systems.
 

 3D Printing and modeling

  • Form1 SLA (Resin) 3D printer. Max build volume (XYZ): 125 x 125 x 165 (mm), or 4.9 x 4.9 x 6.5 (Inch). Available colour: Grey (others upon request with 2 weeks lead time).
  • Kossel FDM (Extruded plastic) Delta printer. Cylindrical build volume (Diameter, Height): 160mm x 290mm, or 6.2 x 11.4 inches. In-stock PLA Filament colours: White, Grey, Black, Orange, Blue, Green, Pink (others upon request with 1-3 days lead time). ABS in-stock Filament: Black, White (others: 1-3 days)
  • Form1 25um layer thickness, 150um min feature size (XY plane).
  • Min feature size: 0.4mm (nozzle diameter), layer height: 0.1 mm - 0.3 mm.