Layout Services

PCB and Hybrid Layout

• We have experince with following technologies:
  • FR4, Duroid (Rogers)
  • MHMIC (Miniature Hybrid Microwave Integrated Circuit)
  • Flexible substrates
• Types of Layout designs:
  • High Speed differential lines for multi-Gbps links, including  DRAM, Serial IO
  • High density routing (eg. BGA breakout).
  • Very high frequency layout (up to 60 GHz).
  • High power (with thermal analysis).
  • Antenna, wave-guide, coax-cable interfaces (up to 60 GHz).

EMI, SI and EMC simulation of PCB layout

• 2.5D and 3D EM simulation
• S-parameter extraction from layout and components models
• TDR (Time Domain Reflectometry) simulations to find sources of SI issues
• Simulation of radiated emissions from PCB traces and devices.
• EMI canister design:
• Full EM and Modal analysis
• Absorbing material optimization
• EMI Gasket optimization

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