Boris Spokoinyi

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Layout Services

PCB and Hybrid Layout

  • We have experince with following technologies:
    • FR4, Duroid (Rogers)
    • LTCC (Low Temperature Co-fired Ceramic)
    • MHMIC (Miniature Hybrid Microwave Integrated Circuit)
    • Flexible substrates
  • Types of Layout designs:
    • High Speed differential lines for multi-Gbps links, including  DRAM, Serial IO
    • High density routing (eg. BGA breakout).
    • Very high frequency layout (up to 60 GHz).
    • High power (with thermal analysis).
    • High layer-count (up to 32 layers).
    • Antenna, wave-guide, coax-cable interfaces (up to 60 GHz).

 

Integrated Circuit (IC) Layout

  • RF/Microwave up to 100 GHz, Mixed Signal: CMOS (IBM, TSMC)  65nm, 90nm, 0.13um, 0.18um
  • RF/Microwave up to 200 GHz: GaAs (WIN foundry) 0.15um pHEMT
  • RF/Microwave up to 20 GHz, High Power:  GaN (NRC, Triquint, Cree): 0.5um

 

EMI (Electro-Magnetic Interference) simulation of the layout

  • 2.5D and 3D EM simulation of EMI effects

-Time Domain Reflectometry to find problems with mismatches
-Far field and near field coupling mechanisms
-Differential line mode coupling

  • EMI canister design:

-Full EM and Modal analysis

-Absorbing material optimization

-EMI Gasket optimization