Layout Services
PCB and Hybrid Layout
- We have experince with following technologies:
- FR4, Duroid (Rogers)
- LTCC (Low Temperature Co-fired Ceramic)
- MHMIC (Miniature Hybrid Microwave Integrated Circuit)
- Flexible substrates
- Types of Layout designs:
- High Speed differential lines for multi-Gbps links, including DRAM, Serial IO
- High density routing (eg. BGA breakout).
- Very high frequency layout (up to 60 GHz).
- High power (with thermal analysis).
- High layer-count (up to 32 layers).
- Antenna, wave-guide, coax-cable interfaces (up to 60 GHz).
Integrated Circuit (IC) Layout
- RF/Microwave up to 100 GHz, Mixed Signal: CMOS (IBM, TSMC) 65nm, 90nm, 0.13um, 0.18um
- RF/Microwave up to 200 GHz: GaAs (WIN foundry) 0.15um pHEMT
- RF/Microwave up to 20 GHz, High Power: GaN (NRC, Triquint, Cree): 0.5um
EMI (Electro-Magnetic Interference) simulation of the layout
- 2.5D and 3D EM simulation of EMI effects
-Time Domain Reflectometry to find problems with mismatches
-Far field and near field coupling mechanisms
-Differential line mode coupling
-Full EM and Modal analysis
-Absorbing material optimization
-EMI Gasket optimization