Layout Services

PCB and Hybrid Layout

• We have experince with following technologies:
  • FR4, Duroid (Rogers)
  • LTCC (Low Temperature Co-fired Ceramic)
  • MHMIC (Miniature Hybrid Microwave Integrated Circuit)
  • Flexible substrates
• Types of Layout designs:
  • High Speed differential lines for multi-Gbps links, including  DRAM, Serial IO
  • High density routing (eg. BGA breakout).
  • Very high frequency layout (up to 60 GHz).
  • High power (with thermal analysis).
  • High layer-count (up to 32 layers).
  • Antenna, wave-guide, coax-cable interfaces (up to 60 GHz).

Integrated Circuit (IC) Layout

• RF/Microwave up to 100 GHz, Mixed Signal: CMOS (IBM, TSMC)  65nm, 90nm, 0.13um, 0.18um
• RF/Microwave up to 200 GHz: GaAs (WIN foundry) 0.15um pHEMT
• RF/Microwave up to 20 GHz, High Power:  GaN (NRC, Triquint, Cree): 0.5um

EMI (Electro-Magnetic Interference) simulation of the layout

• 2.5D and 3D EM simulation of EMI effects

-Time Domain Reflectometry to find problems with mismatches
-Far field and near field coupling mechanisms
-Differential line mode coupling

• EMI canister design:

-Full EM and Modal analysis

-Absorbing material optimization

-EMI Gasket optimization

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