Boris Spokoinyi

Services

We have extensive expertise designing complex RF/Analog systems & components from DC up to mm-wave frequencies for Bluetooth, Wi-Fi, DVB-T/H, GSM, LTE, GPS, and custom proprietary standards. We also do 3D printing at MatterCreator

 

Call us, toll-free, at 1·888·506·8628, or fill out the online form

 

 RF/Microwave Design
 Digital Design
 Layout Services
 Modeling
 Embedded software

 

 

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We have extensive expertise in designing complex RF systems and components from low frequencies up to and including mm-wave bands for Bluetooth, Wi-Fi, ZigBee, DVB-T/H, GSM, GPS, and custom proprietary standards.

 

 RF/Microwave Design

  • Passive Components: Antennas, Filters, Matching Networks, Splitters/Combiners
  • Active Components: PAs, LNAs, Mixers
  • RF systems: Frequency Synthesizers, Up/Down converters
 

 Digital Design

  • Digital Signal Processing (DSP)
  • Processor interfaces and high speed buses: DDR, 10G Ethernet, JESD204B
  • Experience in Xilinx, Altera, Lattice Semi FPGAs/CPLDs
 

 Layout Services

  • High frequency (up to 60GHz)
  • High density layout (BGA breakout, up to 32 layers)
  • EMC compliance (2D/3D EM simulation)
 

 Modeling & Simulation

  • 2D/3D Electromagnetic simulation (PCB elements, antennas, waveguides).
  • Circuit simulation (RF, analog, digital).
  • System simulation (comunication systems, control, hardware, firmware, DSP).
  • Thermal and Mechanical simulation.
 

 Embedded Software

  • C/C++ coding for Microcontrollers and CPUs.
  • Firmware/Hardware co-development.
  • Digital Signal Processing (DSP) and Control Systems.
 

 3D Printing and modeling at MatterCreator.com

  • SLA printers max build volume (XYZ): 125 x 125 x 165 mm, or 4.9″ x 4.9″ x 6.5″ (inch). Min feature size: 300 microns, min layer thickness: 25 microns (1 mil). Resin types: Grey, White, Translucent, Strong, Castable.
  • Multiple FDM Printers width dual-extruders. Max build volume is 300 x 300 x 400mm, or 11.8″ x 11.8″ x 19.6″ (inch). Min feature size: 0.4mm (nozzle diameter), layer height: 0.1 mm – 0.3 mm. PLA Colours:  Black, White, Orange, Grey, Silver, Transparent, Red, Pink, Blue (Dark/Light), Brown, Bronze-color, Yellow, Green (Dark/Light). ABS Colours:  Black, Grey, White, Silver, Orange.
 

We have experience in the following areas:

  • PLB/OPB bus interfaces for Xilinx FPGAs
  • Custom design of memory controllers, DMA optimization
  • DSP design: all blocks required for Software Defined Radios (FIR/IIR, DDS/NCO, FFT, ECC, etc.)
  • Non-linear amplifier pre-distortion
 

We have experience with the following FPGAs:

  • Xilinx: Virtex2,4,5,6, Spartan 3,6
  • Altera: Stratix 3,4
  • Lattice Semi: MachXO, LatticeXP
 

We have extensive expertise in designing complex RF systems and components from low frequencies up to and including mm-wave bands for Bluetooth (including BLE/Smart), Wi-Fi, ZigBee, DVB-T/H, GSM, GPS, and custom proprietary standards.

 

Receivers, Transmitters, Transceivers

  • Custom direct conversion (zero-IF) and super-heterodyne with high speed ADC/DACs
  • 2.4 GHz Bluetooth, 2.4GHz/5.8GHz 802.11 based products
  • RF energy harvesting (RFID, battery-less sensors, wireless charging)
  • Emissions (EMI) optimization, spurious planning and avoidance (EM simulation, on-board algorithms)
  • Sideband and LO feed-through compensation
  • TX/RX feedback minimization
 

Passive

  • Antennas and phased arrays
  • Filters (Distributed, Lumped, Ceramic-based), Diplexers
  • Couplers
  • Matching networks (for: PA, LNA, Antenna, Mixers)
  • Combiners/splitters 

 

Frequency Synthesizers and Generators (up to 60GHz)

  • Sub-Hz step-size (DDS-based and Fractional PLL)
  • Ultra-low phase noise  (< 1 degree RMS jitter)
  • Fast frequency switching (using DDS, high speed DACs, switched VCOs)
  • Ultra-wideband (50MHz - 14GHz with integrated dividers, DDS based)
  • Microphonics compensation (using active feedback, passive)

 

 

PCB and Hybrid Layout

  • We have experince with following technologies:
    • FR4, Duroid (Rogers)
    • LTCC (Low Temperature Co-fired Ceramic)
    • MHMIC (Miniature Hybrid Microwave Integrated Circuit)
    • Flexible substrates
  • Types of Layout designs:
    • High Speed differential lines for multi-Gbps links, including  DRAM, Serial IO
    • High density routing (eg. BGA breakout).
    • Very high frequency layout (up to 60 GHz).
    • High power (with thermal analysis).
    • High layer-count (up to 32 layers).
    • Antenna, wave-guide, coax-cable interfaces (up to 60 GHz).

 

Integrated Circuit (IC) Layout

  • RF/Microwave up to 100 GHz, Mixed Signal: CMOS (IBM, TSMC)  65nm, 90nm, 0.13um, 0.18um
  • RF/Microwave up to 200 GHz: GaAs (WIN foundry) 0.15um pHEMT
  • RF/Microwave up to 20 GHz, High Power:  GaN (NRC, Triquint, Cree): 0.5um

 

EMI (Electro-Magnetic Interference) simulation of the layout

  • 2.5D and 3D EM simulation of EMI effects

-Time Domain Reflectometry to find problems with mismatches
-Far field and near field coupling mechanisms
-Differential line mode coupling

  • EMI canister design:

-Full EM and Modal analysis

-Absorbing material optimization

-EMI Gasket optimization