We have extensive expertise in designing complex RF systems and components from low frequencies up to and including mm-wave bands for Bluetooth, Wi-Fi, ZigBee, DVB-T/H, GSM, GPS, and custom proprietary standards.

 RF/Microwave Design

• Passive Components: Antennas, Filters, Matching Networks, Splitters/Combiners

 Antennas: IFA, monopole, dipole, quasi-yagi, patch, Vivaldi, Arrays, MIMO, LTE

• Active Components: PAs, LNAs, Mixers
• RF systems: Frequency Synthesizers, Up/Down converters

 Digital Design

• Digital Signal Processing (DSP)
• Processor interfaces and high speed buses: DDR, 10G Ethernet, JESD204B
• Experience in Xilinx, Altera, Lattice Semi FPGAs/CPLDs

 Layout Services

• High frequency (up to 60GHz)
• High density layout (BGA breakout, up to 32 layers)
• EMC compliance (2D/3D EM simulation)

 Modeling & Simulation

• 2D/3D Electromagnetic simulation (PCB elements, antennas, waveguides).
• Circuit simulation (RF, analog, digital).
• System simulation (comunication systems, control, hardware, firmware, DSP).
• Thermal and Mechanical simulation.

 Embedded Software

• C/C++ coding for Microcontrollers and CPUs.
• Firmware/Hardware co-development.
• Digital Signal Processing (DSP) and Control Systems.

We have experience in the following areas:

• PLB/OPB bus interfaces for Xilinx FPGAs
• Custom design of memory controllers, DMA optimization
• DSP design: all blocks required for Software Defined Radios (FIR/IIR, DDS/NCO, FFT, ECC, etc.)
• Non-linear amplifier pre-distortion

We have experience with the following FPGAs:

We have extensive expertise in designing complex RF systems and components from low frequencies up to and including mm-wave bands for Bluetooth (including BLE/Smart), Wi-Fi, ZigBee, DVB-T/H, GSM, GPS, and custom proprietary standards.

Receivers, Transmitters, Transceivers

• Custom direct conversion (zero-IF) and super-heterodyne with high speed ADC/DACs
• 2.4 GHz Bluetooth, 2.4GHz/5.8GHz 802.11 based products
• RF energy harvesting (RFID, battery-less sensors, wireless charging)
• Emissions (EMI) optimization, spurious planning and avoidance (EM simulation, on-board algorithms)
• Sideband and LO feed-through compensation
• TX/RX feedback minimization

Passive

• Antennas and phased arrays
• Filters (Distributed, Lumped, Ceramic-based), Diplexers
• Couplers
• Matching networks (for: PA, LNA, Antenna, Mixers)
• Combiners/splitters 

Frequency Synthesizers and Generators (up to 60GHz)

• Sub-Hz step-size (DDS-based and Fractional PLL)
• Ultra-low phase noise  (< 1 degree RMS jitter)
• Fast frequency switching (using DDS, high speed DACs, switched VCOs)
• Ultra-wideband (50MHz - 14GHz with integrated dividers, DDS based)
• Microphonics compensation (using active feedback, passive)

PCB and Hybrid Layout

• We have experince with following technologies:
  • FR4, Duroid (Rogers)
  • MHMIC (Miniature Hybrid Microwave Integrated Circuit)
  • Flexible substrates
• Types of Layout designs:
  • High Speed differential lines for multi-Gbps links, including  DRAM, Serial IO
  • High density routing (eg. BGA breakout).
  • Very high frequency layout (up to 60 GHz).
  • High power (with thermal analysis).
  • Antenna, wave-guide, coax-cable interfaces (up to 60 GHz).

EMI, SI and EMC simulation of PCB layout

• 2.5D and 3D EM simulation
• S-parameter extraction from layout and components models
• TDR (Time Domain Reflectometry) simulations to find sources of SI issues
• Simulation of radiated emissions from PCB traces and devices.
• EMI canister design:
• Full EM and Modal analysis
• Absorbing material optimization
• EMI Gasket optimization